Transverse
Pilot line for wafer-scale micro-transfer printing
Micro-Transfer Printing
Micro-Transfer Printing enables the precise, mass transfer of various components (e.g. lasers, modulators, photodetectors). The ability to integrate diverse materials and components with high alignment precision make it ideal for heterogeneous integration.
Pilot line
The pilot line provides a platform for partners to evaluate and develop wafer scale micro-transfer printing processes (200mm) for their products. The expertise of imec and Ghent University in heterogeneous integration supports development-on-demand and prototyping.
Proven Experience and Expertise
Imec and UGent have a proven track record of heterogeneous integration through Micro-Transfer Printing. The pilot line is supported by this research expertise and is therefore placed at the forefront of Micro-Transfer Printing development.
Efficient and versatile
The wide range of possible components and materials that can be transferred onto various substrates make Micro -Transfer Printing a highly versatile integration method. Micro-Transfer Printing selectively transfers only the required devices or components and thereby optimizes the use of expensive source materials.
Latest News
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Kick-off seminar at PIC International
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Meet us @ Photonics West 2025!
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Launch website and LinkedIn
Our Services
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Platform augmentation
Using micro-transfer printing we are augmenting platforms of various silicon photonic platform providers (e.g. IMEC) to include advanced modulators, optical amplifiers and lasers.
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Prototyping
Innovation through rapid prototyping enables to quickly test, refine, and optimize designs and process flows, paving the way for efficient and successful commercialization.
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Development-on-Demand
Through Development on Demand projects in close collaboration with partners we ensure flexible and tailored solutions for process- and device development
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Supply Chain Development
After development, we can support the manufacturing for a limited volume while helping with setting up the supply chain for larger volumes.
Platform and Material Diversity
Versatility is inherent to Micro Transfer-Printing (MTP). MTP enables the integration of a diverse range of materials/components (e.g. III-V semiconductors, lithium niobate) on a large variety of platforms (e.g. silicon, silicon nitride, Lithium Niobate, …)
From high-performance optical components to electronic chiplets, MTP supports a wide range of applications. Our publications showcase only a part of the technology’s capabilities, highlighting innovations in photonics, electronics, and beyond.
Publications
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Micro-transfer-printed short-wave infrared InP-on-silicon tunable laser
Xin Guo et al., Optics Letters, doi.org/10.1364/OL.549540, (2025)
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Centimetre-scale micro-transfer printing toenable heterogeneous integration of thin filmlithium niobate with silicon photonics
Margot Niels et al, Opt. Mater. Express 15, doi.org/10.1364/OME.551748, (2025)
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A High-speed heterogenous lithium tantalate silicon photonics platform
M. Niels et al, arxiv, doi.org/10.48550/arXiv.2503.10557
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Heterogeneous integration of a High-Speed Lithium Niobate Modulator on Silicon Nitride using Micro-Transfer Printing
T. Vanackere, et al.. APL Photonics https://doi.org/10.1063/5.0150878 (2023)
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Present and future of micro-transfer printing for heterogeneous photonic integrated circuits
Gunther Roelkens et al. APL Photonics . https://doi.org/10.1063/5.0181099 (2024)
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Integrated Resonant Electro‐Optic Comb Enabled by Platform‐Agnostic Laser Integration
I. Luntadila Lufungula et al. , Lasers & Photonics Reviews, doi:10.1002/lpor.202400205 (2024)
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III-V-on-Si3N4 widely tunable narrow-linewidth laser based on micro-transfer printing
B. Pan, et al., Photonics Research, 11(12), doi:10.1364PRJ.530925 (2024)