We are pleased to share that the TRANSVERSE pilot line is featured in the latest issue of Advanced Packaging Magazine (Issue 1, 2026).
In the feature article, our team explores how TRANSVERSE is bridging the gap between academic innovation and industrial manufacturing by moving micro-transfer printing (MTP) from device-level laboratory demonstrations to 200 mm wafer-scale validation.
The article highlights key pilot-line metrics critical for volume adoption, including:
- Overlay accuracy across full 200 mm wafers
- Transfer yield and repeatability
- Throughput targets for commercial readiness
- Device performance, featuring benchmark data on integrated TFLN modulators and UTC photodiodes
The full issue offers valuable perspectives on heterogeneous integration, co-packaged optics, and the evolution of advanced packaging. We invite you to read the full issue to learn more about how TRANSVERSE is establishing a European pilot line for MTP-enabled silicon photonics.
