In the INTERREG LIGHTUP project, Transverse, the wafer-scale micro-transfer printing pilot line of imec and Ghent University, is partnering with SMART Photonics to bring C-band SOAs into the Imec Silicon Photonics Platform (ISIPP) silicon photonics platform.
📅 In Q1 2026, a shuttle will be launched, creating the first opportunity for LIGHTUP partners to explore the possibilities and performance of ISIPP circuits with heterogeneously integrated SOAs. With only five seats available in this initial run, a select group of partners will gain early access to prototype on this enhanced platform.
By combining imec’s leadership in silicon photonics and micro-transfer printing with SMART Photonics’ world-class InP technology, this collaboration is paving the way for more powerful, versatile, and scalable photonic solutions.
📩 Interested in joining LIGHTUP as a partner? Contact us at info@transverse.technology.com
